Inspection Robots with GPU Module Cards in Power Substations
12/06/2023
Challenges
- Palm-sized, minimum Core i computing power, with flexibility for AI acceleration for different user scenarios & easy assembly
- Multi-camera, sensor, and I/O applications
- Must work outdoors with high reliability
Solutions
- 3.5”, USB4 Type-C flexible choice for MXM GPU modules and convenient assembly
- Various I/Os and sensor interface design on one board
- Wide power input (12-24V), wide operating temp. (-40~85°C)
- DeviceOn remote management with validated wireless modules
System Diagram
Powered by High-Performance, Low-Power SBC MIO-5377
Performance Computing Power with Integrated AI：
• 3.5”(146x102mm) SBC with up to 96EUs for parallel AI workload
• Optional MXM GPU module through USB4 (Type C)
Multiple & High Speed I/O, Sensors within one Main Board：
• 1 x USB 4 (Type C), 1 x USB 3.2 (Type C), 4 x USB3.2, 2 x USB2.0, 2 x GbE
• 6 x COM (1Mbps), 3 x I2C (1Mbps), 2 x CANBus
Support Indoor/ Outdoor and Reliable Design：
• Temp. -40 ~ 85°C
• 12-24 VDC wide-range power input
• TDP 15W/ 28W, fan/fanless
Benefits
- 3.5 SBC and flexible selection on AI acceleration modules for different applications to save space, shorten development schedules, and reduce costs
- Multiple high-speed I/Os in one board to save costs to find other solutions and reduce integration efforts
- Rugged design with wide power input and wide operating temp to operate under harsh environments
-25/ahtKDWLM20220504111143.jpg)
